3D inspection system with high speed and high resolution

Features

Cameras can be selected from a varied lineup according to the application of the inspection. (Example) 0.55–5.0 μm height resolution, and 5–30 μm/pixel horizontal resolution
Example of 3D variation: 106 mm/s scanning speed was achieved at 0.55 μm height resolution, 5 μm horizontal resolution, and 35 mm visual field size.
Color image inspection is also simultaneously performed using our original image inspection software, based on the 2D color image data captured at the same time as the 3D image data.
In this product, created through collaboration with Linx Corporation, 3D and 2D inspection equipment has been incorporated into transportation equipment that has been tailored to customer specifications, and systematized at our own factory.

Overview

Stereo-method line scan camera
Uses the high resolution of the line sensors to capture micro-textures and reconstruct shapes
Minimum height measurements of 5 µm horizontally and 0.35 µm vertically

Simultaneously acquires full color and height images in one scan
Achieves advanced inspection, combining shape information and 2D information in full color

　Ceramic circuit boards: Pattern film thickness, slight unevenness, via depth, circuit board warpage, and height of adhered foreign matter

　BGA bumps: Height, diameter, and coplanarity

　Connectors: Flatness of terminals and shrinking of resin parts

　Lead frames: Coplanarity of inner leads

　Others: Scratches on the surfaces of films/glasses/resin moldings/press moldings/cast products, and slight unevenness

　Semiconductors: Disbonding from wire bonding/bond pads; height abnormalities, etc.

Software	Multifunctional image processing software Hu-Dra
Cameras	3DPIXA
Equipment size	1,000 (W) x 1,300 (D) x 1,800 (H) mm (excluding rotating warning light and HEPA)