Rotary module head (RMH)-equipped high-speed component transfer equipment
Features
- This equipment is used for transferring components; it receives ceramic packages, high-function module components, and semiconductor chip components from the common area, and arranges and stores them in trays or other locations.
- Due to its high-speed and high-precision transfer unit with 16 rotary nozzles, it provides high-quality transfer of components and enables high productivity.
- The supply side is compatible with workpieces, both loose and stored in a tray.
- Since our inspection software is developed in-house, we can quickly respond to any requests for additions or modifications after delivery.
Overview
■Main Configuration
■Target Products (Examples)
Chip components such as chip capacitors and chip resistors, quartz crystal units, high-frequency communication components, optical communication components, ceramic packages, lids, resin circuit boards, lenses, power semiconductors, CMOS image sensors, LEDs, and photodiodes
Specifications
| Software | Multifunctional image inspection software Hu-Dra |
|---|---|
| Cameras | 12-megapixel monochromatic camera (for surface imaging), 4,000-pixel monochromatic line camera (for rear side imaging) |
| Equipment Size (mm) | Approx. 1,300 (W) x 1,200 (D) x 1,800 (H) mm *Excluding the rotating warning light |
| Number of Cycles | Maximum 25,000 pieces/h |
| Workpiece Size | 0.3–13 mm |
| Others | Auto nozzle changer function, storage height correction function, and loader/unloader addition |