Visual inspection equipment for wafers (before dicing)
Features
- Capable of high-speed and high-precision inspection of visual defects that occur in the wafer and dicing processes.
- Image resolution can be selected according to inspection precision level. Macro inspection (approx. 10 um resolution or better)
- Autofocus function (optional)
- Equipped with a function to check for all marking errors (optional)
- Function for ID reading and mapping data output (optional)
Overview
■Viewer software
- Display function for inspection results mapping
- Magnified display function for non-conforming chips
- Display function for non-conforming item classification (non-conforming items/total number of inspections/OK/Non-conforming)
■Target Products (Examples)
Various wafers types, power semiconductors, CMOS image sensors, LEDs, photodiodes
Specifications
| Software | Multifunctional image inspection software Hu-Dra |
|---|---|
| Cameras | 5-megapixel monochromatic area camera (micro inspection), 12-megapixel monochromatic area camera (macro inspection) and 25-megapixel monochromatic area camera (alignment) |
| Equipment size | 1,350 (W) x 1,350 (D) x 1,800 (H) mm (excluding rotating warning light and HEPA) |
| Others | Lenses and lighting should be selected according to the workpiece and inspection contents. |